- 专利标题: SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF
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申请号: US18676161申请日: 2024-05-28
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公开(公告)号: US20240313013A1公开(公告)日: 2024-09-19
- 发明人: Masahiro JOEI , Kenichi MURATA , Fumihiko KOGA , Iwao YAGI , Shintarou HIRATA , Hideaki TOGASHI , Yosuke SAITO
- 申请人: SONY GROUP CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SONY GROUP CORPORATION
- 当前专利权人: SONY GROUP CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP 18097228 2018.05.21
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H01L29/41 ; H04N25/771 ; H10K39/32
摘要:
A solid-state imaging element with pixel transistors and wires capable of efficiently outputting and transferring a pixel signal from a stacked photoelectric conversion film while suppressing an increase in manufacturing cost, and a manufacturing method thereof are provided. There is provided a solid-state imaging element which includes a semiconductor substrate; a first photoelectric conversion unit provided on the semiconductor substrate; and a control unit provided stacked with the first photoelectric conversion unit and including a plurality of pixel transistors, in which the first photoelectric conversion unit includes a second electrode, a first photoelectric conversion film provided above the second electrode and converting light into charges, and a first electrode provided on the first photoelectric conversion film, the plurality of pixel transistors include an amplification transistor that amplifies and outputs the charges as a pixel signal, and a channel formation region of the amplification transistor made of an oxide semiconductor layer.
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