A semiconductor package includes: a first redistribution structure having a structure including at least one first redistribution layer and at least one first insulating layer; a first semiconductor chip disposed on the first redistribution structure; a second semiconductor chip disposed on the first redistribution structure; and bumps disposed between the first redistribution structure and the first semiconductor chip and between the first redistribution structure and the second semiconductor chip, wherein the at least one first redistribution layer includes a detour redistribution line disposed so that a portion of the detour redistribution line overlaps a space between the first and second semiconductor chips, and the detour redistribution line circuitously extends across the space between the first and second semiconductor chips so as not to overlap a stress concentration region partially overlapping a portion of the space between the first and second semiconductor chips, or extends into the stress concentration region.