发明公开
- 专利标题: SEMICONDUCTOR DEVICE
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申请号: US18657752申请日: 2024-05-07
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公开(公告)号: US20240290652A1公开(公告)日: 2024-08-29
- 发明人: Chia-Chung Chen , Chi-Feng Huang , Victor Chiang Liang , Chung-Hao Chu , Ching-Yu Yang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 分案原申请号: US16883958 2020.05.26
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L21/324 ; H01L29/08 ; H01L29/165 ; H01L29/45 ; H01L29/66 ; H01L29/78
摘要:
A semiconductor device includes a first gate stack structure over a substrate, a source/drain epitaxial layer, a lightly doped region, and a silicide region. The source/drain epitaxial layer is disposed in the substrate and adjacent to the first gate stack structure. The lightly doped region is located in the substrate to be electrically connected to the source/drain epitaxial layer. The lightly doped region includes a first portion protrudes from a sidewall of the source/drain epitaxial layer. The silicide region is in contact with a top surface and sidewalls of a top portion of the source/drain epitaxial layer and a top surface of the first portion of the lightly doped region. The top portion of the source/drain epitaxial layer is higher than the top surface of the first portion of the lightly doped region.
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