Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE HAVING ANISOTROPIC LAYER
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Application No.: US18123995Application Date: 2023-03-21
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Publication No.: US20240274715A1Publication Date: 2024-08-15
- Inventor: Kai-Hsiang Wang , Yi-Fan Li , Chung-Ting Huang , Chi-Hsuan Tang , Chun-Jen Chen , Ti-Bin Chen , Chih-Chiang Wu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN 2310107548.5 2023.02.13
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/165 ; H01L29/66

Abstract:
A semiconductor device includes a gate structure on a substrate and an epitaxial layer adjacent to the gate structure, in which the epitaxial layer includes a first buffer layer, an anisotropic layer on the first buffer layer, a second buffer layer on the first buffer layer, and a bulk layer on the anisotropic layer. Preferably, a concentration of boron in the bulk layer is less than a concentration of boron in the anisotropic layer, a concentration of boron in the first buffer layer is less than a concentration of boron in the second buffer layer, and the concentration of boron in the second buffer layer is less than the concentration of boron in the anisotropic layer.
Information query
IPC分类: