Invention Publication
- Patent Title: INTERCONNECT DEVICE AND METHOD
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Application No.: US18089417Application Date: 2022-12-27
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Publication No.: US20240213163A1Publication Date: 2024-06-27
- Inventor: Jung Kyu Han
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/535
- IPC: H01L23/535 ; H01L23/00 ; H01L23/538 ; H01L23/544 ; H01L23/66 ; H01L25/065
Abstract:
An electronic device and associated methods are disclosed. In one example, the electronic device includes vertical connections with a layer including tin between the vertical connections and conductive traces. In selected examples, a layer including tin is used in conjunction with other interface layers. In selected examples, a layer including tin is used in all vertical connections.
Public/Granted literature
- US1279577A Operating mechanism for pounder washing-machines. Public/Granted day:1918-09-24
Information query
IPC分类:
