Invention Publication
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATION METHOD THEREOF
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Application No.: US18097286Application Date: 2023-01-16
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Publication No.: US20240178285A1Publication Date: 2024-05-30
- Inventor: Yi-Wei Lien , Wei-Chih Cheng , Shyh-Chiang Shen , Hsin-Chang Tsai
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW 1145878 2022.11.30
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/20 ; H01L29/66 ; H01L29/778

Abstract:
A high electron mobility transistor includes a semiconductor channel layer and a semiconductor barrier layer disposed on a substrate. A source electrode, a gate electrode and a drain electrode are disposed on the semiconductor channel layer. A patterned dielectric layer is disposed on the semiconductor barrier layer, and between the gate electrode and the drain electrode. A first field plate is extended continuously from a side of the patterned dielectric layer to the top surface thereof, and has a step in height. A first dielectric layer is disposed between the semiconductor barrier layer and the patterned dielectric layer. A second dielectric layer covers the patterned dielectric layer. The dielectric constant of the patterned dielectric layer is higher than that of the first dielectric layer and the second dielectric layer.
Information query
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