Invention Publication
- Patent Title: ELECTRONIC DEVICES COMPRISING A STACK STRUCTURE, A SOURCE CONTACT, AND A DIELECTRIC MATERIAL
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Application No.: US18421820Application Date: 2024-01-24
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Publication No.: US20240162325A1Publication Date: 2024-05-16
- Inventor: Michael A. Lindemann , Collin Howder , Yoshiaki Fukuzumi , Richard J. Hill
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L21/28 ; H01L29/417 ; H01L29/792 ; H10B43/27 ; H10B43/35
Abstract:
Electronic devices comprising a doped dielectric material adjacent to a source contact, tiers of alternating conductive materials and dielectric materials adjacent to the doped dielectric material, and pillars extending through the tiers, the doped dielectric material, and the source contact and into the source stack. Related methods and electronic systems are also disclosed.
Information query
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