Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
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Application No.: US18368635Application Date: 2023-09-15
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Publication No.: US20240147698A1Publication Date: 2024-05-02
- Inventor: Geonyeop Lee , Dongwook Kim , Yangdoo Kim , Sangki Nam , Sangwuk Park , Minkyu Suh , Dokeun Lee , Sungho Jang , Jungpyo Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220139113 2022.10.26
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A semiconductor device includes; a lower structure, lower electrodes on the lower structure, wherein each lower electrode includes a first lower electrode and a second lower electrode on the first lower electrode and electrically connected to the first lower electrode, an upper electrode covering the lower electrodes, and a dielectric film between the lower electrodes and the upper electrode, wherein the first lower electrode includes a pillar portion and a protruding portion on the pillar portion, wherein protruding portion has a complex shape that contacts the second lower electrode.
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