Invention Publication
- Patent Title: SENSOR AND ELECTRONIC DEVICE
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Application No.: US18175242Application Date: 2023-02-27
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Publication No.: US20240085451A1Publication Date: 2024-03-14
- Inventor: Kei MASUNISHI , Etsuji OGAWA , Yasushi TOMIZAWA , Fumito MIYAZAKI , Daki ONO , Kengo UCHIDA , Hiroki HIRAGA , Shiori KAJI , Hideaki MURASE
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Priority: JP 22146096 2022.09.14
- Main IPC: G01P15/097
- IPC: G01P15/097 ; G01P15/18

Abstract:
According to one embodiment, a sensor includes a base body, a support portion fixed to the base body, and a first member supported by the support portion. A gap is provided between the base body and a part of the first member. The first member includes a supported region, a first movable region, a first structure, a first support structure, a first connection structure, a first connect portion, and a first beam. The support portion is located between the base body and the supported region in a first direction from the base body to the support portion. The first beam extends along a second direction crossing the first direction. A first beam position of the first beam is located between a first movable region position of the first movable region and a support portion position of the support portion in the second direction.
Information query
IPC分类: