Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
-
Application No.: US18380754Application Date: 2023-10-17
-
Publication No.: US20240063276A1Publication Date: 2024-02-22
- Inventor: Heon Bok LEE , Dae Yong KIM , Wan Don KIM , Jeong Hyuk YIM , Won Keun CHUNG , Hyo Seok CHOI , Sang Jin HYUN
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20180152262 2018.11.30
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/66 ; H01L29/08 ; H01L21/768 ; H01L29/78

Abstract:
A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction, a gate electrode on the active pattern, the gate electrode extending in a second direction intersecting the first direction and including a first portion and a second portion arranged along the second direction, a first contact plug on the gate electrode, the first contact plug being connected to a top surface of the second portion of the gate electrode, a source/drain region in the active pattern on a sidewall of the gate electrode, and a source/drain contact on the source/drain region, a height of a top surface of the source/drain contact being higher than a top surface of the first portion of the gate electrode and lower than the top surface of the second portion of the gate electrode.
Public/Granted literature
- US12087833B2 Semiconductor device and method for fabricating the same Public/Granted day:2024-09-10
Information query
IPC分类: