Invention Application
- Patent Title: Finfet Device Having A Channel Defined In A Diamond-Like Shape Semiconductor Structure
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Application No.: US17986119Application Date: 2022-11-14
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Publication No.: US20230060423A1Publication Date: 2023-03-02
- Inventor: You-Ru Lin , Cheng-Hsien Wu , Chih-Hsin Ko , Clement Hsingjen Wann
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/04 ; H01L29/78 ; H01L21/02 ; H01L21/306 ; H01L29/16 ; H01L29/161 ; H01L29/165 ; H01L21/762 ; H01L29/06 ; H01L29/08

Abstract:
The present disclosure provides a FinFET device. The FinFET device comprises a semiconductor substrate of a first semiconductor material; a fin structure of the first semiconductor material overlying the semiconductor substrate, wherein the fin structure has a top surface of a first crystal plane orientation; a diamond-like shape structure of a second semiconductor material disposed over the top surface of the fin structure, wherein the diamond-like shape structure has at least one surface of a second crystal plane orientation; a gate structure disposed over the diamond-like shape structure, wherein the gate structure separates a source region and a drain region; and a channel region defined in the diamond-like shape structure between the source and drain regions.
Information query
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