- 专利标题: SEMICONDUCTOR MEMORY DEVICE HAVING MEMORY CHIP BONDED TO A CMOS CHIP INCLUDING A PERIPHERAL CIRCUIT
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申请号: US18239140申请日: 2023-08-29
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公开(公告)号: US20230402087A1公开(公告)日: 2023-12-14
- 发明人: Hiroshi MAEJIMA
- 申请人: Kioxia Corporation
- 申请人地址: JP Tokyo
- 专利权人: Kioxia Corporation
- 当前专利权人: Kioxia Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP 21045906 2021.03.19
- 主分类号: G11C11/4091
- IPC分类号: G11C11/4091 ; G11C11/4094 ; G11C5/06 ; G11C11/4074 ; G11C11/408 ; G11C16/24 ; G11C16/26 ; G11C16/04
摘要:
A memory device includes a first memory cell provided above a substrate; a first bit line coupled to the first memory cell and extending in a first direction; a first sense amplifier configured to sense a voltage of the first bit line; a second memory cell provided above the substrate; a second bit line adjacent to the first bit line and extending in the first direction, the second bit line being coupled to the second memory cell; a second sense amplifier configured to sense a voltage of the second bit line; and a third memory cell provided above the substrate. A third bit line not adjacent to the second bit line extends in the first direction, and is coupled to the third memory cell; and a third sense amplifier is configured to sense a voltage of the third bit line. The first and second sense amplifiers belong to a first sense amplifier group, are adjacent to each other and are arranged in a second direction intersecting the first direction. The third sense amplifier belongs to a second sense amplifier group. The first and second sense amplifier groups are adjacent to each other and are arranged in the first direction.
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