Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US18091425Application Date: 2022-12-30
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Publication No.: US20230246103A1Publication Date: 2023-08-03
- Inventor: Yusuke KUBO
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP 22012548 2022.01.31
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes: a semiconductor substrate including a main surface and a back surface opposite to the main surface; a semiconductor layer including a first surface in contact with the main surface of the semiconductor substrate and a second surface opposite to the first surface, and including a gate trench recessed in the second surface; a split gate structure provided in the gate trench; an insulating layer filling the gate trench and covering the second surface of the semiconductor layer; and a trap level region formed in any one of the semiconductor layer and the semiconductor substrate to trap carriers moving from the semiconductor layer.
Information query
IPC分类: