• Patent Title: REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
  • Application No.: US17772641
    Application Date: 2020-10-19
  • Publication No.: US20220390826A1
    Publication Date: 2022-12-08
  • Inventor: Yohei IKEBEOsamu NOZAWA
  • Applicant: HOYA CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: HOYA CORPORATION
  • Current Assignee: HOYA CORPORATION
  • Current Assignee Address: JP Tokyo
  • Priority: JP2019-210488 20191121
  • International Application: PCT/JP2020/039208 WO 20201019
  • Main IPC: G03F1/24
  • IPC: G03F1/24 G03F1/48 G03F1/26
REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
Provided is a reflective mask blank comprising a phase shift film having a small change in the phase difference and/or reflectance of the phase shift film even in a case where the film thickness of the phase shift film changes.
A reflective mask blank comprises a multilayer reflective film and a phase shift film in this order on a main surface of a substrate. The phase shift film comprises a lower layer and an uppermost layer. The lower layer is located between the uppermost layer and the multilayer reflective film. The lower layer is formed of a material in which the total content of ruthenium and chromium is 90 atomic % or more, or a material in which the total content of ruthenium, chromium, and nitrogen is 90 atomic % or more. The uppermost layer is formed of a material in which the total content of ruthenium, chromium, and oxygen is 90 atomic % or more.
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