Invention Application
- Patent Title: SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
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Application No.: US17225907Application Date: 2021-04-08
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Publication No.: US20220328482A1Publication Date: 2022-10-13
- Inventor: Wen-Ting Lan , Shi Ning Ju , Kuo-Cheng Chiang , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/417 ; H01L29/78 ; H01L29/66 ; H01L21/8234

Abstract:
A semiconductor device structure, along with methods of forming such, are described. The structure includes a semiconductor fin having a first portion having a first width and a second portion having a second width substantially less than the first width. The first portion has a first surface, the second portion has a second surface, and the first and second surfaces are connected by a third surface. The third surface forms an angle with respect to the second surface, and the angle ranges from about 90 degrees to about 130 degrees. The structure further includes a gate electrode layer disposed over the semiconductor fin and source/drain epitaxial features disposed on the semiconductor fin on opposite sides of the gate electrode layer.
Public/Granted literature
- US11664378B2 Semiconductor device structure and methods of forming the same Public/Granted day:2023-05-30
Information query
IPC分类: