• 专利标题: SEMICONDUCTOR APPARATUS, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC DEVICE, ILLUMINATION APPARATUS, MOVING OBJECT, AND MANUFACTURING METHOD FOR SEMICONDUCTOR APPARATUS
  • 申请号: US17707684
    申请日: 2022-03-29
  • 公开(公告)号: US20220320463A1
    公开(公告)日: 2022-10-06
  • 发明人: Toshio Tomiyoshi
  • 申请人: CANON KABUSHIKI KAISHA
  • 申请人地址: JP Tokyo
  • 专利权人: CANON KABUSHIKI KAISHA
  • 当前专利权人: CANON KABUSHIKI KAISHA
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2021-058490 20210330
  • 主分类号: H01L51/52
  • IPC分类号: H01L51/52 H01L27/32 H01L51/56
SEMICONDUCTOR APPARATUS, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC DEVICE, ILLUMINATION APPARATUS, MOVING OBJECT, AND MANUFACTURING METHOD FOR SEMICONDUCTOR APPARATUS
摘要:
A semiconductor apparatus includes a translucent sheet and a semiconductor device that includes an effective pixel area and a peripheral area. A first bonding member is disposed between the peripheral area and the translucent sheet. A second bonding member is disposed between the effective pixel area and the translucent sheet. The first bonding member and the second bonding member are in contact with each other via a first interface. The second bonding member is made of a resin. The second bonding member includes a first part, and a second part disposed between the first part and the first bonding member and in contact with the first bonding member via the first interface. A cure ratio of the second part is lower than a cure ratio of the first part.
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