Invention Application
- Patent Title: DIRECT BONDING AND DEBONDING OF CARRIER
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Application No.: US17708688Application Date: 2022-03-30
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Publication No.: US20220319901A1Publication Date: 2022-10-06
- Inventor: Dominik Suwito , Gaius Gillman Fountain, JR. , Guilian Gao
- Applicant: INVENSAS BONDING TECHNOLOGIES, INC.
- Applicant Address: US CA San Jose
- Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
- Current Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78
Abstract:
A bonding method is disclosed. The method can include directly bonding a first nonconductive bonding material of a semiconductor element to a second nonconductive bonding material of a carrier without an intervening adhesive. The first nonconductive bonding material is disposed on a device portion of the semiconductor element. The second nonconductive bonding material is disposed on a bulk portion of the carrier. A deposited dielectric layer is disposed between the device portion and the bulk portion. The method can include removing the carrier from the semiconductor element by transferring thermal energy to the dielectric layer to induce diffusion of gas out of the dielectric layer.
Information query
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