Invention Application
- Patent Title: IMAGING ELEMENT, STACKED IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE, AND INORGANIC OXIDE SEMICONDUCTOR MATERIAL
-
Application No.: US17611980Application Date: 2020-04-30
-
Publication No.: US20220255027A1Publication Date: 2022-08-11
- Inventor: TOSHIKI MORIWAKI , HIROSHI NAKANO , YOICHIRO IINO
- Applicant: SONY GROUP CORPORATION
- Applicant Address: JP TOKYO
- Assignee: SONY GROUP CORPORATION
- Current Assignee: SONY GROUP CORPORATION
- Current Assignee Address: JP TOKYO
- Priority: JP2019-097457 20190524
- International Application: PCT/JP2020/018224 WO 20200430
- Main IPC: H01L51/42
- IPC: H01L51/42 ; H01L27/30 ; H01L29/24

Abstract:
An imaging element includes a photoelectric conversion section including a first electrode 21, a photoelectric conversion layer 23A including an organic material, and a second electrode 22 that are stacked; an inorganic oxide semiconductor material layer 23B is formed between the first electrode 21 and the photoelectric conversion layer 23A; and when a composition of an inorganic oxide semiconductor material included in the inorganic oxide semiconductor material layer 23B is represented by MaNbSncO (where M denotes an aluminum (Al) atom, and N denotes a gallium atom (Ga) or a zinc (Zn) atom, or a gallium (Ga) atom and a zinc (Zn) atom), a+b+c=1.00, 0.01≤a≤0.04, and b
Information query
IPC分类: