- 专利标题： MODULAR ZONE CONTROL FOR A PROCESSING CHAMBER
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申请号： US17064389申请日： 2020-10-06
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公开(公告)号： US20220108891A1公开(公告)日： 2022-04-07
- 发明人: Zubin Huang , Manjunath Veerappa Chobari Patil , Diwakar Kedlaya , Truong Van Nguyen , Pavan Kumar Murali Kumar , Subrahmanyam Veerisetty , Venkata Sharat Chandra Parimi , Fang Ruan
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L21/033
- IPC分类号： H01L21/033 ; H01J37/32 ; C23C16/50 ; C23C16/455 ; H01L21/02 ; C23C16/04
摘要：
Exemplary semiconductor processing chambers may include a faceplate assembly characterized by at least one surface defining a number of voids. Each void is configured to receive an interchangeable thermal body that can be selected from multiple interchangeable thermal bodies. Exemplary semiconductor processing chambers may also include a gas box characterized by movable members. Each movable member is configured to engage a delivery port and is movable to provide flow control for a gas being delivered to the processing volume through a gas flow path. Zoned flow and/or temperature control may be provided by the faceplate assembly, the gas box, or both.
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