- 专利标题: FIELD-EFFECT TRANSISTORS WITH DUAL THICKNESS GATE DIELECTRICS
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申请号: US16699566申请日: 2019-11-30
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公开(公告)号: US20210167180A1公开(公告)日: 2021-06-03
- 发明人: Ayan Kar , Kalyan C. Kolluru , Nicholas A. Thomson , Mark Armstrong , Sameer Jayanta Joglekar , Rui Ma , Sayan Saha , Hyuk Ju Ryu , Akm A. Ahsan
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L27/02 ; H01L29/78 ; H01L29/08 ; H01L29/40
摘要:
Disclosed herein are transistor arrangements of field-effect transistors with dual thickness gate dielectrics. An example transistor arrangement includes a semiconductor channel material, a source region and a drain region, provided in the semiconductor material, and a gate stack provided over a portion of the semiconductor material that is between the source region and the drain region. The gate stack has a thinner gate dielectric in a portion that is closer to the source region and a thicker gate dielectric in a portion that is closer to the drain region, which may effectively realize tunable ballast resistance integrated with the transistor arrangement and may help increase the breakdown voltage and/or decrease the gate leakage of the transistor.
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