- 专利标题： SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
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申请号： US16680795申请日： 2019-11-12
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公开(公告)号： US20210143107A1公开(公告)日： 2021-05-13
- 发明人: Seungwon IM , Oseob JEON
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/495 ; H01L21/48
摘要：
In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive.
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