- 专利标题： CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING AN ELECTRICAL CONTACT
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申请号： US17090941申请日： 2020-11-06
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公开(公告)号： US20210082861A1公开(公告)日： 2021-03-18
- 发明人: Joachim Mahler , Michael Bauer , Jochen Dangelmaier , Reimund Engl , Johann Gatterbauer , Frank Hille , Michael Huettinger , Werner Kanert , Heinrich Koerner , Brigitte Ruehle , Francisco Javier Santos Rodriguez , Antonio Vellei
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102016109349.1 20160520
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L23/29 ; H01L21/02 ; H01L23/495
摘要：
In various embodiments, a method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.
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