- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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申请号: US16548744申请日: 2019-08-22
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公开(公告)号: US20210057524A1公开(公告)日: 2021-02-25
- 发明人: Shih-Yen LIN , Kuan-Chao CHEN , Hsuan-An CHEN , Lun-Ming LEE
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , NATIONAL TAIWAN UNIVERSITY
- 申请人地址: TW Hsinchu; TW Taipei
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- 当前专利权人地址: TW Hsinchu; TW Taipei
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/24 ; H01L29/45 ; H01L29/768 ; H01L29/66 ; H01L21/283
摘要:
A semiconductor device includes a substrate, semiconductor 2-D material layer, a conductive 2-D material layer, a gate dielectric layer, and a gate electrode. The semiconductor 2-D material layer is over the substrate. The conductive 2-D material layer extends along a source/drain region of the semiconductor 2-D material layer, in which the conductive 2-D material layer comprises a group-IV element. The gate dielectric layer extends along a channel region of the semiconductor 2-D material layer. The gate electrode is over the gate dielectric layer.
公开/授权文献
- US11121214B2 Source/drain contact with 2-D material 公开/授权日:2021-09-14
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