Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
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Application No.: US16361231Application Date: 2019-03-22
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Publication No.: US20200295176A1Publication Date: 2020-09-17
- Inventor: Zhi-Cheng Lee , Wei-Jen Chen , Kai-Lin Lee
- Applicant: UNITED MICROELECTRONICS CORP.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@59e81b48
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/51 ; H01L29/165 ; H01L29/06 ; H01L29/66

Abstract:
A semiconductor structure includes at least one stacked fin structure, a gate and a source/drain. At least one stacked fin structure is located on a substrate, wherein the stacked fin structure includes a first fin layer and a second fin layer, and a fin dielectric layer is sandwiched by the first fin layer and the second fin layer. The gate is disposed over the stacked fin structure. The source/drain is disposed directly on the substrate and directly on sidewalls of the whole stacked fin structure. The present invention provides a semiconductor process formed said semiconductor structure.
Public/Granted literature
- US10861974B2 Semiconductor structure and process thereof Public/Granted day:2020-12-08
Information query
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