- 专利标题： ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS
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申请号： US16398228申请日： 2019-04-29
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公开(公告)号： US20190355697A1公开(公告)日： 2019-11-21
- 发明人: Min-Chen Lin , Yi-Hui Lee , Che-Ya Chou , Nan-Cheng Chen
- 申请人： MEDIATEK INC.
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/31 ; H01L23/00 ; H01L23/528 ; H01L23/522
摘要：
An electronic package configured to operate at Gigabit-per-second (Gbps) data rates is disclosed. The electronic package includes a package substrate of a rectangular shape. A chip package having a first high-speed interface circuit die is mounted on a top surface of the package substrate. The chip package is rotated relative to the package substrate above a vertical axis that is orthogonal to the top surface through about 45 degrees. The first high-speed interface circuit die includes a first Serializer/Deserializer (SerDes) circuit block.
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