Invention Application
- Patent Title: SEMICONDUCTOR PACKAGES
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Application No.: US15891305Application Date: 2018-02-07
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Publication No.: US20190244909A1Publication Date: 2019-08-08
- Inventor: Yong-Da CHIU , Shiu-Chih WANG , Shang-Kun HUANG , Ying-Ta CHIU , Shin-Luh TARNG , Chih-Pin HUNG
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/00
Abstract:
A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.
Information query
IPC分类:
