Various embodiments of the present invention relate to thermal management devices and methods of making the same. In various embodiments, the present disclosure provides a heat sink system (250, 252) including a heat sink (200, 253) having thermal wicks (214) and cooling structures (205). The thermal wicks (214) can extend from a heat source (48) at a first end (202) of the heat sink (200, 253) to a second end (204) and the cooling structure (205) can include at least one channel (246) configured to receive a thermal transport material positioned within the main body (201) of the heat sink (200, 253).