Invention Application
- Patent Title: METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE
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Application No.: US16222630Application Date: 2018-12-17
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Publication No.: US20190122924A1Publication Date: 2019-04-25
- Inventor: JIN HEE PARK , TAE HONG HA , SANG-HYEOB LEE , THOMAS JONGWAN KWON , JAESOO AHN , XIANMIN TANG , ER-XUAN PING , SREE KESAPRAGADA
- Applicant: APPLIED MATERIALS, INC.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/67 ; C23C16/04 ; C23C16/455 ; C23C16/48 ; H01L21/285 ; H01L23/532 ; C23C16/56 ; C23C16/18 ; C23C16/16

Abstract:
Methods and apparatus for depositing a cobalt layer in a feature, such as, a word line formed in a substrate, are provided herein. In some embodiments, method of processing a substrate includes: exposing a substrate at a first temperature to a cobalt containing precursor to deposit a cobalt layer within a word line feature formed in the substrate, wherein the word line feature is part of a 3D NAND device; and annealing the substrate to remove contaminants from the cobalt layer and to reflow the cobalt layer into the word line feature, wherein the substrate is at a second temperature greater than the first temperature during the annealing.
Public/Granted literature
- US10714388B2 Method and apparatus for depositing cobalt in a feature Public/Granted day:2020-07-14
Information query
IPC分类: