- 专利标题： SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
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申请号： US16090602申请日： 2017-04-03
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公开(公告)号： US20190122899A1公开(公告)日： 2019-04-25
- 发明人: Yong-Tae KWON , Jun-Kyu LEE , Si Woo LIM , Dong Hoon OH , Jun Sung MA , Tae-Won KIM
- 申请人： NEPES CO., LTD.
- 申请人地址： KR Eumseong-gun Chungcheongbuk-do
- 专利权人： NEPES CO., LTD.
- 当前专利权人： NEPES CO., LTD.
- 当前专利权人地址： KR Eumseong-gun Chungcheongbuk-do
- 优先权： KR10-2016-0041141 20160404
- 国际申请： PCT/KR2017/003644 WO 20170403
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L23/525 ; H01L23/552
摘要：
A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.
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