- 专利标题: Conductive Diamond Application Method and System
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申请号: US15792275申请日: 2017-10-24
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公开(公告)号: US20190118346A1公开(公告)日: 2019-04-25
- 发明人: Erick Merle Spory
- 申请人: Erick Merle Spory
- 申请人地址: US CO Colorado Springs
- 专利权人: Global Circuit Innovations Inc.
- 当前专利权人: Global Circuit Innovations Inc.
- 当前专利权人地址: US CO Colorado Springs
- 主分类号: B24D18/00
- IPC分类号: B24D18/00 ; H01B1/04 ; H01B5/14 ; H01B13/00 ; B33Y10/00 ; B33Y30/00 ; B29C64/106 ; B29C64/141 ; B29C64/20
摘要:
A method is provided. The method includes preparing a surface to receive a 3D printed layer, 3D printing a conductive layer comprising a plurality of overlaid layers of conductive material to the surface, and 3D printing conductive diamonds to the conductive layer. Preparing the surface includes one or more of texturing the surface and chemically treating the surface. The texturing is performed in order to not adversely impact regularity of the surface and limit variations in the height from the surface of conductive diamonds. Chemically treating the surface reduces films or coatings that may impact adhesion between the surface and the conductive layer, without degrading the conductive layer.
公开/授权文献
- US10654259B2 Conductive diamond application method 公开/授权日:2020-05-19
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