- 专利标题: NANOWIRE BENDING FOR PLANAR DEVICE PROCESS ON (001) Si SUBSTRATES
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申请号: US15573772申请日: 2016-05-13
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公开(公告)号: US20180358226A1公开(公告)日: 2018-12-13
- 发明人: Seung-Chang Lee , Steven R.J. Brueck
- 申请人: STC.UNM
- 国际申请: PCT/US2016/032501 WO 20160513
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/311 ; H01L21/306 ; H01L21/285 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786
摘要:
Provided is a method for growing a nanowire, including: providing a substrate with a base portion having a first surface and at least one support structure extending above or below the first surface; forming a dielectric coating on the at least one support structure; forming a photoresist coating over the substrate; forming a metal coating over at least a portion of the dielectric coating; removing a portion of the dielectric coating to expose a surface of the at least one support structure; removing a portion of the at least one support structure to form a nanowire growth surface; growing at least one nanowire on the nanowire growth surface of a corresponding one of the at least one support structure, wherein the nanowire comprises a root end attached to the growth surface and an opposing, free end extending from the root end; and elastically bending the at least one nanowire.
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