Invention Application
- Patent Title: ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
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Application No.: US15778042Application Date: 2015-11-24
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Publication No.: US20180350709A1Publication Date: 2018-12-06
- Inventor: Pramod Malatkar , Kyle Yazzie , Naga Sivakumar Yagnamurthy , Richard J. Harries , Dilan Seneviratne , Praneeth Akkinepally , Xuefei Wan , Yonggang Li , Robert L. Sankman
- Applicant: INTEL CORPORATION
- International Application: PCT/US2015/062397 WO 20151124
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/498 ; H01L25/10
Abstract:
An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.
Public/Granted literature
- US10985080B2 Electronic package that includes lamination layer Public/Granted day:2021-04-20
Information query
IPC分类:
