公开(公告)号：US10985080B2

公开(公告)日：2021-04-20

申请号：US15778042

申请日：2015-11-24

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

公开(公告)号：US20180350709A1

公开(公告)日：2018-12-06

申请号：US15778042

申请日：2015-11-24

Applicant: INTEL CORPORATION

Inventor： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/34 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

公开(公告)号：US10231338B2

公开(公告)日：2019-03-12

申请号：US14748496

申请日：2015-06-24

Applicant: INTEL CORPORATION

Inventor： Naga Sivakumar Yagnamurthy ,  Huiyang Fei ,  Pramod Malatkar ,  Prasanna Raghavan ,  Robert Nickerson

IPC: H01L23/28 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K1/11 ,  B29C70/84 ,  B29C70/70 ,  B29C70/88 ,  B29C37/00 ,  B29C33/00 ,  B29C69/00 ,  G11C11/401 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  B29K63/00 ,  B29L31/34 ,  G11C5/04 ,  H05K1/14

Abstract: Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die.

公开(公告)号：US20160381800A1

公开(公告)日：2016-12-29

申请号：US14748496

申请日：2015-06-24

Applicant: INTEL CORPORATION

Inventor： Naga Sivakumar Yagnamurthy ,  Huiyang Fei ,  Pramod Malatkar ,  Prasanna Raghavan ,  Robert Nickerson

IPC: H05K1/18 ,  B29C70/84 ,  B29C70/70 ,  G11C11/401 ,  B29C37/00 ,  B29C33/00 ,  B29C69/00 ,  H05K1/11 ,  B29C70/88

CPC classification number: H05K1/181 ,  B29C33/0033 ,  B29C37/0025 ,  B29C69/001 ,  B29C70/70 ,  B29C70/84 ,  B29C70/882 ,  B29K2063/00 ,  B29K2995/0005 ,  B29L2031/3481 ,  G11C5/04 ,  G11C11/401 ,  H01L23/48 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/1815 ,  H05K1/111 ,  H05K1/144 ,  H05K2201/0379 ,  H05K2201/09036 ,  H05K2201/10159 ,  H05K2203/041

Abstract: Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die.

Abstract translation: 描述形成包括沟槽的封装结构的方法。 实施例包括设置在第一基板上的第一管芯和设置在第一基板的周边区域上的至少一个互连结构。 在第一基板的一部分上和第一模具上设置模塑料，其中沟槽开口设置在位于至少一个互连结构和第一模之间的模塑料中。

公开(公告)号：US11327050B2

公开(公告)日：2022-05-10

申请号：US15900668

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Rajesh Kumar Neerukatti ,  Naga Sivakumar Yagnamurthy ,  David C. McCoy ,  Pramod Malatkar ,  Frank P. Prieto

IPC: G01N29/44 ,  G01N29/14

Abstract: Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.

公开(公告)号：US10957656B2

公开(公告)日：2021-03-23

申请号：US16641601

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Pramod Malatkar ,  Chia-Pin Chiu ,  Mohit Mamodia ,  Mark J. Gallina ,  Rajesh Kumar Neerukatti ,  Joseph Bautista ,  Michael Gregory Drake

IPC: H01L23/40 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

Abstract: Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.

公开(公告)号：US20190257793A1

公开(公告)日：2019-08-22

申请号：US15900668

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Rajesh Kumar Neerukatti ,  Naga Sivakumar Yagnamurthy ,  David C. McCoy ,  Pramod Malatkar ,  Frank P. Prieto

IPC: G01N29/14 ,  G01N29/44

Abstract: Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.