- 专利标题： SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
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申请号： US15596956申请日： 2017-05-16
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公开(公告)号： US20180337130A1公开(公告)日： 2018-11-22
- 发明人: Chien Lin CHANG CHIEN , Chin-Li KAO , Shih-Yu WANG , Chang Chi LEE
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/48 ; H01L23/498 ; H01L21/683
摘要：
A semiconductor package device includes a first interconnection structure, a non-silicon interposer and a first die. The first interconnection structure has a first pitch. The non-silicon interposer surrounds the first interconnection structure. The non-silicon interposer includes a second interconnection structure having a second pitch. The second pitch is larger than the first pitch. The first die is above the first interconnection structure and is electrically connected to the first interconnection structure.
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