- 专利标题: HIGH RESOLUTION THERMOPILE INFRARED SENSOR ARRAY HAVING MONOLITHICALLY INTEGRATED SIGNAL PROCESSING
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申请号: US15766100申请日: 2016-07-05
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公开(公告)号: US20180283958A1公开(公告)日: 2018-10-04
- 发明人: Bodo FORG , Michael SCHNORR , Jörg SCHIEFERDECKER , Karlheinz STORCK , Marion SIMON , Wilhelm LENEKE
- 申请人: HEIMANN SENSOR GMBH
- 申请人地址: DE Dresden
- 专利权人: HEIMANN SENSOR GMBH
- 当前专利权人: HEIMANN SENSOR GMBH
- 当前专利权人地址: DE Dresden
- 优先权: DE102015116866.9 20151005
- 国际申请: PCT/EP2016/065844 WO 20160705
- 主分类号: G01J5/08
- IPC分类号: G01J5/08 ; G01J5/22 ; H04N5/33 ; H04N5/378 ; G01J5/14
摘要:
A high-resolution thermopile infrared sensor array having monolithically integrated signal processing and a plurality of parallel signal processing channels for the signals from pixels of a sensor array, and a digital port for the serial output of the pixel signals are provided, wherein the sensor array is located on one or more sensor chips. The thermal piled infrared sensor array possesses low power loss, high integration density and high thermal and geometric resolution. Each signal processing channel (K1 . . . KN) has at least one analogue/digital converter (ADC), and is assigned a memory region in a memory (RAM) for storing the signals from the pixels (SE).
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