- 专利标题: MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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申请号: US15911708申请日: 2018-03-05
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公开(公告)号: US20180261633A1公开(公告)日: 2018-09-13
- 发明人: Junichi KOEZUKA , Naoto YAMADE , Yuhei SATO , Yutaka OKAZAKI , Shunpei YAMAZAKI
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 优先权: JP2011-100040 20110427
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/477 ; H01L29/786 ; H01L21/02 ; H01L21/383 ; H01L21/44 ; H01L29/66
摘要:
A semiconductor device using an oxide semiconductor is provided with stable electric characteristics to improve the reliability. In a manufacturing process of a transistor including an oxide semiconductor film, an oxide semiconductor film containing a crystal having a c-axis which is substantially perpendicular to a top surface thereof (also called a first crystalline oxide semiconductor film) is formed; oxygen is added to the oxide semiconductor film to amorphize at least part of the oxide semiconductor film, so that an amorphous oxide semiconductor film containing an excess of oxygen is formed; an aluminum oxide film is formed over the amorphous oxide semiconductor film; and heat treatment is performed thereon to crystallize at least part of the amorphous oxide semiconductor film, so that an oxide semiconductor film containing a crystal having a c-axis which is substantially perpendicular to a top surface thereof (also called a second crystalline oxide semiconductor film) is formed.
公开/授权文献
- US10249651B2 Manufacturing method of semiconductor device 公开/授权日:2019-04-02
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