Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US15425723Application Date: 2017-02-06
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Publication No.: US20180226365A1Publication Date: 2018-08-09
- Inventor: Chang-Lin YEH , Jen-Chieh KAO , Chih-Yi HUANG , Fu-Chen CHU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/498 ; H01L43/02
Abstract:
A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.
Public/Granted literature
- US10074622B2 Semiconductor package device and method of manufacturing the same Public/Granted day:2018-09-11
Information query
IPC分类:
