Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Application No.: US15643488Application Date: 2017-07-07
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Publication No.: US20170323824A1Publication Date: 2017-11-09
- Inventor: Ching-Yu Chang , Ssu-I Fu , Yu-Hsiang Hung , Chih-Kai Hsu , Wei-Chi Cheng , Jyh-Shyang Jenq
- Applicant: UNITED MICROELECTRONICS CORP.
- Priority: CN201610292063.8 20160505
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/02 ; H01L29/66 ; H01L29/423 ; H01L27/088 ; H01L23/532 ; H01L21/8238 ; H01L21/8234 ; H01L21/311 ; H01L21/28

Abstract:
A semiconductor device includes: a substrate, a gate structure on the substrate, and a spacer adjacent to the gate structure, in which the spacer extends to a top surface of the gate structure, a top surface of the spacer includes a planar surface, the spacer encloses an air gap, and the spacer is composed of a single material. The gate structure includes a high-k dielectric layer, a work function metal layer, and a low resistance metal layer, in which the high-k dielectric layer is U-shaped. The semiconductor device also includes an interlayer dielectric (ILD) layer around the gate structure and a hard mask on the spacer, in which the top surface of the hard mask is even with the top surface of the ILD layer.
Public/Granted literature
- US10062604B2 Semiconductor device and method for fabricating the same Public/Granted day:2018-08-28
Information query
IPC分类: