- 专利标题: POLYIMIDE-BASED POLYMER THICK FILM RESISTOR COMPOSITION
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申请号: US15380210申请日: 2016-12-15
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公开(公告)号: US20170200539A1公开(公告)日: 2017-07-13
- 发明人: Seigi Suh
- 申请人: E I DU PONT DE NEMOURS AND COMPANY
- 主分类号: H01C17/065
- IPC分类号: H01C17/065 ; C08K3/04 ; H01C7/00 ; C09D5/24 ; B05D1/42 ; B05D1/32 ; C08J5/18 ; C08K3/08
摘要:
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
公开/授权文献
- US10153075B2 Polyimide-based polymer thick film resistor composition 公开/授权日:2018-12-11
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