Invention Application
- Patent Title: FINFET AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): FINFET及其制造方法
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Application No.: US13954991Application Date: 2013-07-31
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Publication No.: US20150035069A1Publication Date: 2015-02-05
- Inventor: Yu-Hsiang Hung , Ssu-I Fu , Chien-Ting Lin , Po-Chao Tsao , Chung-Fu Chang , Cheng-Guo Chen
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsin-Chu City
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsin-Chu City
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238

Abstract:
A method for fabricating fin-shaped field-effect transistor (FinFET) is disclosed. The method includes the steps of: providing a substrate; forming a fin-shaped structure in the substrate; forming a shallow trench isolation (STI) on the substrate and around the bottom portion of the fin-shaped structure; forming a first gate structure on the STI and the fin-shaped structure; and removing a portion of the STI for exposing the sidewalls of the STI underneath the first gate structure.
Public/Granted literature
- US08981487B2 Fin-shaped field-effect transistor (FinFET) Public/Granted day:2015-03-17
Information query
IPC分类: