Invention Application
- Patent Title: IMAGE PICKUP MODULE
- Patent Title (中): 图像拾取模块
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Application No.: US14504644Application Date: 2014-10-02
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Publication No.: US20150014805A1Publication Date: 2015-01-15
- Inventor: Masashi YAMADA
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2012-086723 20120405
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0224
Abstract:
An image pickup module includes: an image pickup chip including a main surface on which a light-receiving portion of an image pickup device and a plurality of electrodes connected to the light-receiving portion are formed; and a wiring board including flying leads bonded to the respective plurality of electrodes.
Public/Granted literature
- US09520434B2 Image pickup module Public/Granted day:2016-12-13
Information query
IPC分类:
