Invention Application
US20140306332A1 Integrating Multi-Output Power Converters Having Vertically Stacked Semiconductor Chips
有权
集成了具有垂直堆叠半导体芯片的多输出功率转换器
- Patent Title: Integrating Multi-Output Power Converters Having Vertically Stacked Semiconductor Chips
- Patent Title (中): 集成了具有垂直堆叠半导体芯片的多输出功率转换器
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Application No.: US14181966Application Date: 2014-02-17
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Publication No.: US20140306332A1Publication Date: 2014-10-16
- Inventor: Marie Denison , Brian Ashley Carpenter , Osvaldo Jorge Lopez , Juan Alejandro Herbsommer , Jonathan Noquil
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/50 ; H01L23/48
Abstract:
A packaged multi-output converter (200) comprising a leadframe with a chip pad (201) as ground terminal and a plurality of leads (202) including the electrical input terminal (203); a first FET chip (sync chip, 220) with its source terminal affixed to the leadframe and on its opposite surface a first drain terminal (221) positioned adjacent to a second drain terminal (222), the drain terminals connected respectively by a first (241) and a second (242) metal clip to a first (204) and second (205) output lead; a second FET chip (control chip, 211), positioned vertically over the first drain terminal, with its source terminal attached onto the first clip; a third FET chip (control chip, 212), positioned vertically over the second drain terminal, with its source terminal attached onto the second clip; and the drain terminals (213, 214) of the second and third chips attached onto a third metal clip (260) connected to the input lead (203).
Public/Granted literature
- US09214415B2 Integrating multi-output power converters having vertically stacked semiconductor chips Public/Granted day:2015-12-15
Information query
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