发明申请
US20140242773A1 PHASE CHANGE MEMORY DEVICE HAVING SELF-ALIGNED BOTTOM ELECTRODE AND FABRICATION METHOD THEREOF 有权
具有自对准底电极的相变存储器件及其制造方法

  • 专利标题: PHASE CHANGE MEMORY DEVICE HAVING SELF-ALIGNED BOTTOM ELECTRODE AND FABRICATION METHOD THEREOF
  • 专利标题(中): 具有自对准底电极的相变存储器件及其制造方法
  • 申请号: US14268668
    申请日: 2014-05-02
  • 公开(公告)号: US20140242773A1
    公开(公告)日: 2014-08-28
  • 发明人: Su Jin CHAEJin Hyock KIMYoung Seok KWON
  • 申请人: SK hynix Inc.
  • 申请人地址: KR Gyeonggi-do
  • 专利权人: SK hynix Inc.
  • 当前专利权人: SK hynix Inc.
  • 当前专利权人地址: KR Gyeonggi-do
  • 优先权: KR10-2012-0093196 20120824
  • 主分类号: H01L45/00
  • IPC分类号: H01L45/00 H01L43/12
PHASE CHANGE MEMORY DEVICE HAVING SELF-ALIGNED BOTTOM ELECTRODE AND FABRICATION METHOD THEREOF
摘要:
A semiconductor memory device and a fabrication method thereof capable of improving electric contact characteristic between an access device and a lower electrode are provided. The semiconductor memory device includes an access device formed in a pillar shape on a semiconductor substrate, a first conductive layer formed over the access device, a protection layer formed on an edge of the first conductive layer to a predetermined thickness, and a lower electrode connected to the first conductive layer.
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