Invention Application
US20140222188A1 ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING
审中-公开
在化学机械抛光中相同板上变化厚度的多个基板的端点控制
- Patent Title: ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING
- Patent Title (中): 在化学机械抛光中相同板上变化厚度的多个基板的端点控制
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Application No.: US14246801Application Date: 2014-04-07
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Publication No.: US20140222188A1Publication Date: 2014-08-07
- Inventor: Alain Duboust , Wen-Chiang Tu , Shih-Haur Shen , Jimin Zhang , Ingemar Carlsson , Boguslaw A. Swedek , Zhihong Wang , Stephen Jew , David H. Mai , Huyen Tran
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.
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