Invention Application
- Patent Title: METHODS AND SYSTEMS FOR POINT OF USE REMOVAL OF SACRIFICIAL MATERIAL
- Patent Title (中): 使用移除材料的方法和系统
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Application No.: US13734696Application Date: 2013-01-04
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Publication No.: US20140191292A1Publication Date: 2014-07-10
- Inventor: Christina INMAN , Alexander MASTROIANNI , Wolfgang HINZ , Shifeng LI , Scott BENSON
- Applicant: LIFE TECHNOLOGIES CORPORATION
- Applicant Address: US CA Carlsbad
- Assignee: LIFE TECHNOLOGIES CORPORATION
- Current Assignee: LIFE TECHNOLOGIES CORPORATION
- Current Assignee Address: US CA Carlsbad
- Main IPC: H01L27/105
- IPC: H01L27/105 ; H01L21/8234

Abstract:
A method of manufacturing a sensor, the method including forming an array of chemically-sensitive field effect transistors (chemFETs), depositing a dielectric layer over the chemFETs in the array, depositing a protective layer over the dielectric layer, etching the dielectric layer and the protective layer to form cavities corresponding to sensing surfaces of the chemFETs, and removing the protective layer. The method further includes, etching the dielectric layer and the protective layer together to form cavities corresponding to sensing surfaces of the chemFETs. The protective layer is at least one of a polymer, photoresist material, noble metal, copper oxide, and zinc oxide. The protective layer is removed using at least one of sodium hydroxide, organic solvent, aqua regia, ammonium carbonate, hydrochloric acid, acetic acid, and phosphoric acid.
Public/Granted literature
- US09080968B2 Methods and systems for point of use removal of sacrificial material Public/Granted day:2015-07-14
Information query
IPC分类: