Invention Application
- Patent Title: Serial thermal linear processor arrangement
- Patent Title (中): 串行热线性处理器布置
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Application No.: US13573486Application Date: 2012-09-17
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Publication No.: US20130175323A1Publication Date: 2013-07-11
- Inventor: Jian ZHANG , Chunghsin Lee
- Applicant: Jian ZHANG , Chunghsin Lee
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers having displacable bottom processing portions. The process begins at a loading station and ends up at an unloading station after various melting and vacuuming of chip/substrate components supported on a device tray through those various chambers to the final joining thereof.
Information query
IPC分类:
