Invention Application
- Patent Title: Dislocation Engineering Using a Scanned Laser
- Patent Title (中): 使用扫描激光的位错工程
-
Application No.: US13565018Application Date: 2012-08-02
-
Publication No.: US20120294322A1Publication Date: 2012-11-22
- Inventor: Chung Woh Lai , Xiao Hu Liu , Anita Madan , Klaus W. Schwarz , J. Campbell Scott
- Applicant: Chung Woh Lai , Xiao Hu Liu , Anita Madan , Klaus W. Schwarz , J. Campbell Scott
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01S3/10
- IPC: H01S3/10
Abstract:
A system for manipulating dislocations on semiconductor devices, includes a moveable laser configured to generate a laser beam locally on a surface portion of the semiconductor body having a plurality of dislocations, the moveable laser being characterized as having a scan speed, the moveable laser manipulates the plurality of dislocations on the surface portion of the semiconductor body by adjusting the temperature and the scan speed of the laser beam.
Information query
