发明申请
US20110062466A1 AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDs
审中-公开
AlxGa(1-x)As衬底,用于红外LED的外延晶片,红外LED,制造Al x Ga(1-x)As衬底的方法,制造用于红外LED的外延晶片的方法以及制造红外LED的方法
- 专利标题: AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDs
- 专利标题(中): AlxGa(1-x)As衬底,用于红外LED的外延晶片,红外LED,制造Al x Ga(1-x)As衬底的方法,制造用于红外LED的外延晶片的方法以及制造红外LED的方法
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申请号: US12921152申请日: 2009-05-27
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公开(公告)号: US20110062466A1公开(公告)日: 2011-03-17
- 发明人: So Tanaka , Kenichi Miyahara , Hiroyuki Kitabayashi , Koji Katayama , Tomonori Morishita , Tatsuya Moriwake
- 申请人: So Tanaka , Kenichi Miyahara , Hiroyuki Kitabayashi , Koji Katayama , Tomonori Morishita , Tatsuya Moriwake
- 申请人地址: JP Osaka
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2008-146052 20080603; JP2009-101226 20090417
- 国际申请: PCT/JP2009/059647 WO 20090527
- 主分类号: H01L33/30
- IPC分类号: H01L33/30 ; H01L29/205 ; H01L21/205
摘要:
Affords AlxGa(1-x)As (0≦x≦1) substrates epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing AlxGa(1-x)As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs, whereby a high level of transmissivity is maintained, and through which, in the fabrication of semiconductor devices, the devices prove to have superior light output characteristics. An AlxGa(1-x)As substrate (10a) as disclosed is an AlxGa(1-x)As substrate (10a) furnished with an AlxGa(1-x)As layer (11) having a major surface (11a) and, on the reverse side from the major surface (11a), a rear face (11b), and is characterized in that in the AlxGa(1-x)As layer (11), the amount fraction x of Al in the rear face (11b) is greater the amount fraction x of Al in the major surface (11a). The AlxGa(1-x)As substrate (10a) may additionally be provided with a GaAs substrate (13), contacting the rear face (11b) of the AlxGa(1-x)As layer (11).
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