Invention Application
US20080206942A1 METHOD FOR FABRICATING STRAINED-SILICON METAL-OXIDE SEMICONDUCTOR TRANSISTORS
有权
用于制备应变硅金属氧化物半导体晶体管的方法
- Patent Title: METHOD FOR FABRICATING STRAINED-SILICON METAL-OXIDE SEMICONDUCTOR TRANSISTORS
- Patent Title (中): 用于制备应变硅金属氧化物半导体晶体管的方法
-
Application No.: US11678627Application Date: 2007-02-26
-
Publication No.: US20080206942A1Publication Date: 2008-08-28
- Inventor: Shyh-Fann Ting , Cheng-Tung Huang , Li-Shian Jeng , Kun-Hsien Lee , Wen-Han Hung , Tzyy-Ming Cheng , Meng-Yi Wu , Tsai-Fu Hsiao , Shu-Yen Chan
- Applicant: Shyh-Fann Ting , Cheng-Tung Huang , Li-Shian Jeng , Kun-Hsien Lee , Wen-Han Hung , Tzyy-Ming Cheng , Meng-Yi Wu , Tsai-Fu Hsiao , Shu-Yen Chan
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/336

Abstract:
A method for fabricating strained-silicon transistors is disclosed. First, a semiconductor substrate is provided and a gate structure and a spacer surrounding the gate structure are disposed on the semiconductor substrate. A source/drain region is then formed in the semiconductor substrate around the spacer, and a first rapid thermal annealing process is performed to activate the dopants within the source/drain region. An etching process is performed to form a recess around the gate structure and a selective epitaxial growth process is performed to form an epitaxial layer in the recess. A second rapid thermal annealing process is performed to redefine the distribution of the dopants within the source/drain region and repair the damaged bonds of the dopants.
Public/Granted literature
- US07927954B2 Method for fabricating strained-silicon metal-oxide semiconductor transistors Public/Granted day:2011-04-19
Information query
IPC分类: