Invention Application
- Patent Title: Semiconductor devices and methods of manufacture thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11508682Application Date: 2006-08-23
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Publication No.: US20080050898A1Publication Date: 2008-02-28
- Inventor: Hongfa Luan
- Applicant: Hongfa Luan
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a method of manufacturing a semiconductor device includes providing a workpiece, disposing a gate dielectric material over the workpiece, and disposing a gate material over the gate dielectric material. Cl or F is introduced to the gate material, wherein introducing the Cl or F to the gate material affects a work function of the gate material. The gate material and the gate dielectric material are patterned, forming at least one transistor.
Information query
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